Solution
| Product name |
Metal |
Use |
| ST-548 |
Stainless steel |
Chemical milling (Stainless Steel) |
| LF-346 |
(Cu) ,Cu alloy |
Lead Frame (Alloy 42) |
| Metal Selective Etching |
Ag/Mo , Al , Cu/Ni Cu/Mo
ITO：Crystal or Amorphous |
Metal+ITO (MSE-3275Z MSE-2275Z SX-S4002) |
| One Step Etching |
ITO： Crystal or Amorphous |
Ag or Cu＋ITO (ITO-4400Z ITO-4900Z) |
| Single Layer |
Non-ferrous
ITO：Crystal or Amorphous |
ITO (SX-67) |
| AL Series |
(Al) |
IC Card , IC Tag, Power module |
| W series |
- |
Wafer Level CSP |
| AD-305 |
- |
Semi Additive |
| cAM Series (Copper chloride additive) |
Copper (Cu), copper (Cu) alloy |
COF, FPCB, PCB, etc. |
PCB-oriented Wiring Formation
There are the FE Series and the TFE Series with bidirectional etching, contributing to the next generation of PCBs.
Metal surface treatment
There are TEC Series and Cleaner Series with improved surface roughness and adhesion, and it performs surface treatment according to the purpose of various metal surfaces.
MEMS Wafer Process
There is the WPM series with metal selective etching and it selectively etches various kinds of metals such as Cu, AI, Ni, Ti, Cr, W, Ta.
FPD Touch Panel
It forms Cu/barrier metal and Cu/ITO uniformly, and there are the ITO series, MSE series, and GA series, and it etches laminated materials of dissimilar metals.
